Capabilities

High SoC Density | Micro-SWaP payload

• Group 1 UAS Man-Portable Payload

• Micro Form Factor: 3.5” W x 2.25” D x 1.0” H, ~40 in³ class ; ~0.75 lb

• Software Defined Radios: Compatible with Snapdragon X75, Wavelet sSDR, Epiq Sidekiq

• Power: 12–40V DC input; PoE compatible; Optimized for low-power edge deployment

Processing Power:

• (1x) Qualcomm QCS-8550 SoM = ~57 TOPs

• 4 nm architecture optimized for extreme-edge AI

Ruggedization:

• IP65 rated

• Shock and vibration isolation ; MIL-STD-810 / 16

• TRACK|TARGET: Local sensor fusion with generation of actionable intelligence and targeting metadata

• Enables platform autonomy

• Enables mission autonomy (x^(n+1) swarming)

• Enables multi-domain interoperability